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Development Strategy for the Core Software and Hardware of Artificial Intelligence in China

Gao Lei, Fu Yongquan, Li Dongsheng, Liao Xiangke

Strategic Study of CAE 2021, Volume 23, Issue 3, Pages 90-97 doi: 10.15302/J-SSCAE-2021.03.008

Abstract:

Artificial intelligence (AI) is an important enabling technology forPromoting AI core software and hardware technologies and industry is strategically significant for theIn this study, we summarize the development status of AI core hardware and software in China and abroadSubsequently, we present the development ideas of China’s AI hardware and software technology andcore hardware, AI core software, and AI-related basic technology.

Keywords： artificial intelligence (AI) core software and hardware AI chip basic intelligent algorithm new enabling

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Detection of solder bump defects on a flip chip using vibration analysis

Junchao LIU, Tielin SHI, Qi XIA, Guanglan LIAO

Frontiers of Mechanical Engineering 2012, Volume 7, Issue 1, Pages 29-37 doi: 10.1007/s11465-012-0314-7

Abstract: Solder bump defects on flip chips are difficult to detect, because the solder bumps are obscured by the chipvibration analysis is presented for detecting missing solder bumps, which is a typical defect in flip chipThe flip chip analytical model is revised by considering the influence of spring mass on mechanical energyThis revised model is then applied to estimate the flip chip resonance frequencies.Therefore, it may provide a guide for the improvement and innovation of the flip chip on-line inspection

Keywords： flip chip defect detection ultrasonic excitation vibration analysis

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Dymola-based multi-parameters integrated optimization for high speed transfer system of LED chip sorter

Jie OUYANG, Bin LI, Shihua GONG

Frontiers of Mechanical Engineering 2013, Volume 8, Issue 2, Pages 118-126 doi: 10.1007/s11465-013-0253-y

Abstract:

To enhance the performance of high speed transfer system of LED chip sorting equipment, its control

Keywords： LED chip sorter multi-domain modeling and simulation parameter optimization modelica language

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Single-chip 3D electric field microsensor

Biyun LING, Yu WANG, Chunrong PENG, Bing LI, Zhaozhi CHU, Bin LI, Shanhong XIA

Frontiers of Mechanical Engineering 2017, Volume 12, Issue 4, Pages 581-590 doi: 10.1007/s11465-017-0454-x

Abstract:

This paper presents a single-chip 3D electric field microsensor, in which a sensing element is set

Keywords： electric field microsensor three-dimensional single-chip in-plane rotation

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Development of an electrorheological chip and conducting polymer based sensor

Xianzhou ZHANG, Weihua LI, Weijia WEN, Yanzhe WU, Gordon WALLACE,

Frontiers of Mechanical Engineering 2009, Volume 4, Issue 4, Pages 472-472 doi: 10.1007/s11465-009-0077-y

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Platform governance in the era of AI and the digital economy

Frontiers of Engineering Management 2023, Volume 10, Issue 1, Pages 177-182 doi: 10.1007/s42524-022-0241-1

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Bridging the gap: Neuro-Symbolic Computing for advanced AI applications in construction

Frontiers of Engineering Management Pages 727-735 doi: 10.1007/s42524-023-0266-0

Abstract: Deep Learning (DL) has revolutionized the field of Artificial Intelligence (AI) in various domains suchNSC has the potential to enable more robust, interpretable, and accurate AI systems in construction by

Keywords： advanced AI in construction safety and quality inspection Neuro-Symbolic Computing Deep Learning

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SIMULATION OF O-BLOWN CO-GASIFICATION OF WOOD CHIP AND POTATO PEEL FOR PRODUCING SYNGAS

Frontiers of Agricultural Science and Engineering 2023, Volume 10, Issue 3, Pages 448-457 doi: 10.15302/J-FASE-2023490

Abstract:

● Low-value biowaste including wood chip and potato peel was valorized

Keywords： Aspen Plus co-gasification potato peel syngas simulation waste reduction wood chip

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Industrial Application of Artificial Intelligence in China: Current Status and Challenges

Xu Wenwei, Xiao Lizhi, Liu He

Strategic Study of CAE 2022, Volume 24, Issue 6, Pages 173-183 doi: 10.15302/J-SSCAE-2022.07.010

Abstract: style="text-align: justify;">Deep learning has enhanced the versatility of artificial intelligence (AIIn the last decade, the AI industry has been spawned and developing rapidly.pertaining to industrial application of AI and propose corresponding suggestions.technologies that focus on full-stack AI, AI basic platform and tool system, and AI root technology,thus to improve the independence of China's AI core technologies.

Keywords： artificial intelligence (AI) enterprise scenarios intelligent solutions application full-stack AI AI root technology

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3D finite element prediction of chip flow, burr formation, and cutting forces in micro end-milling of

A. DAVOUDINEJAD, P. PARENTI, M. ANNONI

Frontiers of Mechanical Engineering 2017, Volume 12, Issue 2, Pages 203-214 doi: 10.1007/s11465-017-0421-6

Abstract: simulations were performed under different cutting conditions to obtain realistic numerical predictions of chipnotable advantages, such as capability to easily handle any type of tool geometry and any side effect on chipThe proposed 3D FE model considers the effects of mill helix angle and cutting edge radius on the chip

Keywords： 3D finite element modeling micro end-milling cutting force chip formation burr formation

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Engineered Vasculature for Organ-on-a-Chip Systems Review

Abdellah Aazmi, Hongzhao Zhou, Yuting Li, Mengfei Yu, Xiaobin Xu, Yutong Wu, Liang Ma, Bin Zhang, Huayong Yang

Engineering 2022, Volume 9, Issue 2, Pages 131-147 doi: 10.1016/j.eng.2021.06.020

Abstract:

Organ-on-a-chip technology, a promising three-dimensional (3D) dynamic culture method, ensures accurateThus, it is essential to integrate the circulatory system into an organ-on-a-chip to recreate tissueThis review discusses the synergy between the vasculature and the emerging organ-on-a-chip technologyIn addition, we review the different steps of a vascularized organ-on-a-chip fabrication process, including

Keywords： Organ-on-a-chip Vasculature Bioprinting Tumor-on-a-chip

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Three-Dimensional Chip Imaging

Marcus Woo

Engineering 2020, Volume 6, Issue 5, Pages 485-486 doi: 10.1016/j.eng.2020.03.009

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Development of electrorheological chip and conducting polymer-based sensor

Xianzhou ZHANG, Weihua LI, Weijia WEN, Yanzhe WU, Gordon WALLACE,

Frontiers of Mechanical Engineering 2009, Volume 4, Issue 4, Pages 393-396 doi: 10.1007/s11465-009-0043-8

Abstract: The developed ER chip worked as an actuator, and it was driven by different voltages and control frequenciesmonotonically when the frequency increases, owing to the time delay in the pressure buildup in the ER chip

Keywords： electrorheological (ER) fluids conducting polymer (CP) polydimethylsioxane (PDMS) driving frequency amplitude bubble counter

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Machine Learning Produces Superhuman Chip Designs

Robert Pollie,

Engineering 2022, Volume 10, Issue 3, Pages 7-9 doi: 10.1016/j.eng.2022.01.006

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Intelligent high-speed cutting database system development

XIANG Kejun, LIU Zhanqiang, AI Xing

Frontiers of Mechanical Engineering 2008, Volume 3, Issue 2, Pages 180-188 doi: 10.1007/s11465-008-0038-x

Abstract: In this paper, the components of a high-speed cutting system are analyzed firstly. The component variables of the high-speed cutting system are classified into four types: uncontrolled variables, process variables, control variables, and output variables. The relationships and interactions of these variables are discussed. Then, by analyzing and comparing intelligent reasoning methods frequently used, the hybrid reasoning is employed to build the high-speed cutting database system. Then, the data structures of high-speed cutting case base and databases are determined. Finally, the component parts and working process of the high-speed cutting database system on the basis of hybrid reasoning are presented.

Keywords： control hybrid reasoning process component uncontrolled